Title:
硬化性樹脂組成物、その硬化物、硬化性複合材料、樹脂付き金属箔、及び回路基板材料用ワニス
Document Type and Number:
Japanese Patent JP7051333
Kind Code:
B2
Abstract:
To provide a curable resin composition capable of providing a cured product or a molded body having improved heat resistance, compatibility, dielectric characteristics, moist heat reliability, and heat proof oxidation degradation properties; a film formed from the resin composition; a curable composite material; a laminate; and copper foil with resin.SOLUTION: A curable resin composition contains (A) polyphenylene ether in which a hydroxyl group present at a terminal of a main chain is modified with a (meth)acrylic acid compound, and (B) a soluble polyfunctional vinyl aromatic polymer which is a copolymer that contains a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, contains 2-80 mol% of an unsaturated hydrocarbon group represented by a formula (a1) with respect to the total sum of (a) and (b), has Mn of 300-100,000, and is soluble in an organic solvent such as toluene.SELECTED DRAWING: None
Inventors:
Kawabe Honest
Shinichi Iwashita
Tsugutoshi Wasano
Shinichi Iwashita
Tsugutoshi Wasano
Application Number:
JP2017162380A
Publication Date:
April 11, 2022
Filing Date:
August 25, 2017
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
B32B15/08; C08F299/02; C08F290/06; C08J5/18; C08L63/00; H05K1/03
Foreign References:
| US20150044485 |
Attorney, Agent or Firm:
Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo
Eiichi Sano
Katsumi Hara
Shuji Hisamoto
Naruse Katsuo
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