Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6564904
Kind Code:
B2
Abstract:
The present disclosure relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate, which is capable of allowing a substrate processing gas to smoothly flow on the substrate. The apparatus for processing the substrate in accordance an exemplary embodiment may form a laminar flow through a gas supply unit disposed on one side of an inner reaction tube and an exhaust duct disposed on the other side of the inner reaction tube, which faces the gas supply unit, to extend up to the outside of an accommodation region of a pedestal in an accommodation space of the inner reaction tube and control a flow of a substrate processing gas supplied onto the substrate.
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Inventors:
Kangsanho
Kim Chandle
Isandon
Kim Chandle
Isandon
Application Number:
JP2018076500A
Publication Date:
August 21, 2019
Filing Date:
April 12, 2018
Export Citation:
Assignee:
Yu-Gen Technology Company Limited
International Classes:
H01L21/31; C23C16/455; C23C16/46
Domestic Patent References:
| JP2004266090A | ||||
| JP2010050439A | ||||
| JP2015183224A | ||||
| JP2014067783A | ||||
| JP9148315A | ||||
| JP9213640A | ||||
| JP9330884A | ||||
| JP2012169307A | ||||
| JP2012178492A | ||||
| JP2018049853A |
Attorney, Agent or Firm:
Maeda patent office