Title:
基板処理方法および基板処理装置
Document Type and Number:
Japanese Patent JP7013309
Kind Code:
B2
Abstract:
A substrate processing method for drying a substrate including a pattern formation surface in which a pattern with a recess is formed. The substrate processing method comprises: a sacrifice layer forming step of forming a sacrifice layer conforming to a surface of the pattern on the pattern formation surface; a fill layer forming step of forming, in a state in which the sacrifice layer is formed, a fill layer for filling the recess of the pattern in the pattern formation surface; a vaporizing step of vaporizing the sacrifice layer in the state in which the fill layer is formed; and a peeling step of peeling, after the sacrifice layer has been vaporized, the fill layer from the pattern formation surface.
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Inventors:
Hiroshi Abe
Manabu Okutani
Yasunori Kanamatsu
Manabu Okutani
Yasunori Kanamatsu
Application Number:
JP2018075587A
Publication Date:
January 31, 2022
Filing Date:
April 10, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; F26B5/16; F26B9/00
Domestic Patent References:
| JP2013042094A | ||||
| JP2018056553A | ||||
| JP2011124313A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office
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