Title:
BOILING COOLER AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3953741
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a boiling cooler whose rigidity is high as a whole, whose heat resistance is superior, in which cracks and refrigerant leakages due to the thermal stress or a pressure change are less likely to be generated and which is manufactured easily.
SOLUTION: The boiling cooler is provided with a plurality of tank segments 10, which comprise through-formed refrigerant passages 14 used to house a liquid-phase refrigerant and which are connected to a heating element on the outside, a frame body 20 forming the outline of a flat space 20a which houses the liquid-phase refrigerant evaporated by the heat of the heating element and partition plates 30 which are composed of brazing sheets with the formed brazing material layers on both faces of a metal plate, which comprise openings 34 for the liquid-phase refrigerant, and communicating with the refrigerant passages 14 in the lower part and which are installed on both sides of the frame body 20. The tank segments 10 are brazed to and integrated with the lower parts of the partition plats 30, in a laminated state with the refrigerant passages 14 being made to communicate with the openings 34 for the liquid- phase refrigerant.
Inventors:
Yasuto Sueki
Yuyama Koharu
Yuyama Koharu
Application Number:
JP2001058653A
Publication Date:
August 08, 2007
Filing Date:
March 02, 2001
Export Citation:
Assignee:
MFA Fabtec Co., Ltd.
International Classes:
F28D15/02; H01L23/427; H05K7/20; (IPC1-7): H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
| JP10209356A |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe