Title:
BONDED STRUCTURE
Document Type and Number:
Japanese Patent JP2863025
Kind Code:
B2
Abstract:
PURPOSE: To provide a bonded structure free from instability such as shrinkage due to bonding layer curing, also ensured to set its dimension in high accuracy as a whole.
CONSTITUTION: When a component A varied in its dimension L1 is to be jointed to a component B varied in its dimension L2 via a bonding layer C, the bonding layer C is filled with an adhesive followed by preserving the system in such a manner that a dimension L necessary for both the components A and B (e.g. between the bottom of the component A and the top of the component B) come to a specified value, and in this state, the adhesive is cured. Thereby, despite variations in the dimensions L1 and L2, the specified dimension L can be realized due to a mechanism that these variations are absorbed through the thickness δ of the bonding layer C.
Inventors:
SUGANO TETSUO
HANZAWA HIROSHI
SATO HIKARI
SAITO TSUTOMU
HANZAWA HIROSHI
SATO HIKARI
SAITO TSUTOMU
Application Number:
JP14542591A
Publication Date:
March 03, 1999
Filing Date:
May 21, 1991
Export Citation:
Assignee:
ARUPUSU DENKI KK
KEMITETSUKU KK
KEMITETSUKU KK
International Classes:
C09J4/00; C09J4/02; C09J5/00; C09J5/02; C09J5/06; G11B5/53; (IPC1-7): C09J5/02; G11B5/53
Domestic Patent References:
| JP273A | ||||
| JP2140067A | ||||
| JP5765712A |
Attorney, Agent or Firm:
Field Saki Teruo