Title:
BONDING DEVICE OF CHIP
Document Type and Number:
Japanese Patent JP2998603
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the bonding device of chips, in which all the surface of a substrate is uniformly heated by equalizing the temperature distribution of the surface of a heat block in the eutectic bonding of chips by mounting a substrate on the heat block.
SOLUTION: Heaters 22 at both edge parts are arranged closer to the upper surface of a heat block 11C than the heaters 22 at a central part among the heaters 22 integrated in the heat block 11C. A substrate 12 is mounted on the heat block 11C and chips 15 are bonded through a gold ribbon 16. Heat of the heat block 11C is dissipated more from both edge parts of it but the difference of the dissipation of the heat is compensated by arranging the heaters 22 at both edge parts closer to the upper surface. Therefore, the temperature distribution of the upper surface of the heat block 11C is kept uniform, all the surface of the substrate 12 are heated uniformly and all of the chips 15 are bonded with good wettability.
Inventors:
Tomoaki Nakanishi
Application Number:
JP21028395A
Publication Date:
January 11, 2000
Filing Date:
August 18, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Domestic Patent References:
| JP52151949A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)