Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JP2021110060
Kind Code:
A
Abstract:
To provide a bonding device capable of improving efficiency of bonding of sheets including fabric and the like.SOLUTION: A bonding device has a lower conveying part that supports a lower sheet from below, and an upper conveying part that contacts an upper sheet from above and sandwiches the upper sheet and the lower sheet between the upper conveying part and the lower conveying part. The bonding device comprises: a conveying mechanism to convey the lower sheet and the upper sheet by the lower conveying part and the upper conveying part in a predetermined conveying direction; a nozzle 6A that discharges adhesive between the upper sheet and the lower sheet; a nozzle support part 60 that movably supports the nozzle 6A between an approach position close to the upper conveying part and a withdrawn position on upstream side of the approach position in the conveying direction; and an upper support part 6B that is provided on upstream side in the conveying direction of the nozzle 6A at the approach position and supports the upper sheet from below. The upper support part 6B is provided on the nozzle support part 60.SELECTED DRAWING: Figure 16
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Inventors:
IWAKOSHI HIROYASU
KURAHASHI TOSHIYUKI
SHIBATA ITARU
MINAGAWA YUICHIRO
KURAHASHI TOSHIYUKI
SHIBATA ITARU
MINAGAWA YUICHIRO
Application Number:
JP2020002418A
Publication Date:
August 02, 2021
Filing Date:
January 09, 2020
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
D06H5/00; A41H43/04
Attorney, Agent or Firm:
Hisashi Yamamoto
Tomohiro Inayama
Tomohiro Inayama