BONDING JIG AND METHOD OF MANUFACTURING CIRCUIT STRUCTURE WITH HEAT DISSIPATOR

Japanese Patent JP2016082017

A

PROBLEM TO BE SOLVED: To provide a bonding jig capable of maintaining a circuit structure and a heat dissipator in adhesion state by applying a pressure thereto until an adhesive is hardened, without applying a pressure to an electronic component when bonding the heat dissipator to the circuit structure, and to provide a method of manufacturing a circuit structure with a heat dissipator using the same.SOLUTION: A bonding jig 1 includes a first jig 2, and a second jig 3. The first jig 2 is arranged on a circuit structure 4. The second jig 3 is arranged below a heat dissipator 6. The first jig 2 has a first jig body 21, and a plurality of pin members 22. The pin members 22 extend perpendicularly from the surface of the first jig body 21 on the circuit structure 4 side, and arranged at a position capable of abutting against the surface of a circuit board 42 while avoiding an electronic component 43. The pin member 22 exhibits ferromagnetism at at least the tip thereof. The second jig 3 has a second jig body 31, and magnets 32. The magnets 32 are provided on the surface of the second jig body 31 on the heat dissipator 6 side, and arranged correspondingly to respective pin members 22.SELECTED DRAWING: Figure 1

MURONOI YU
CHEN DENG
MATSUI KATSUFUMI

JP2014210644A

May 16, 2016

October 15, 2014

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AUTO NETWORK GIJUTSU KENKYUSHO KK
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES

H05K7/06; H01L23/40; H02G3/16; H05K7/20

Patent Business Corporation Aichi International Patent Office

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