To provide a bonding method and a bonding device capable of improving the service life of electrodes for performing resistance heating of bonding members comprising a conductive material.
The bonding device includes: first and second electrodes 102, 104 electronically connected to first and second bonding members 160, 170; an electric current supplying means 110 for making an electric current flow from the first electrode to the second electrode via the first bonding member, an intermediate member 180, and the second bonding member; a holding means 120 for holding the first and second bonding members in a relatively static state with respect to first and second contact surfaces 182, 184 of the intermediate member; a sliding means 130 for sliding the first and second contact surfaces against the first and second bonding members; and a control means 150 for controlling the sliding means and the electric current supplying means, and bonding by performing resistance heating by making an electric current flow from the first electrode to the second electrode via the first bonding member, the intermediate member, and the second bonding member, while sliding the first and second contact surfaces against the first and second bonding members.
USHIJIMA KENJI
MIZUNO HIDEAKI
| JP2009000700A | 2009-01-08 | |||
| JP2007118059A | 2007-05-17 | |||
| JPH05337639A | 1993-12-21 | |||
| JPS57146492A | 1982-09-09 | |||
| JPH07116868A | 1995-05-09 | |||
| JP2004174546A | 2004-06-24 |
| FR2696116A1 | 1994-04-01 | |||
| DE968008C | 1958-01-02 |
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