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Title:
BONDING METHOD OF METALLIC MEMBER AND COMPOSITE MEMBER
Document Type and Number:
Japanese Patent JP2010188373
Kind Code:
A
Abstract:

To provide a bonding method of metallic members with each other for uniformly heating metallic members containing an amorphous alloy without causing any crystallization, and bonding them with each other.

The bonding method of the metallic members using a pressing tool comprises an installing step S1 of installing a plurality of metallic members with their bonding surfaces being brought into contact with each other, and a pressing and heating step S2 of heating the plurality of metallic members by generating discharged plasma by applying the pulse voltage to the metallic members while pressing the metallic members by the pressing tool. At least one of the plurality of metallic members is formed of an amorphous alloy having a supercooled liquid area of ≥20°C. In the heating and pressing step S2, the bonding surfaces of the plurality of metallic members are heated to the temperature in the range of the supercooled liquid area. In the pressing tool, the area of a pressing surface in contact with the metallic members during the pressing is set to be ≥2 times and <16 times the area of the surface in contact with the pressing tool in the plurality of metallic members.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
SAITO KURATO
SUDA NOBUYUKI
HANAYAMA YUKICHI
Application Number:
JP2009034606A
Publication Date:
September 02, 2010
Filing Date:
February 17, 2009
Export Citation:
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Assignee:
OLYMPUS CORP
International Classes:
B23K20/00; C22C16/00; C22C45/00
Domestic Patent References:
JP2008214704A2008-09-18
JP2002283060A2002-10-02
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Tadao Takashiba
Hiroshi Masui