Title:
BONDING PANEL STRUCTURE AND PANEL
Document Type and Number:
Japanese Patent JP3442660
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture a bonding panel structure and a panel thereof keeping the lightweight properties and controlling the deformation, buckling, swelling and defects of a bonding section generated at the time of friction bonding.
SOLUTION: In the constitution of a bonding panel structure 1, a plurality of post plates 3 are installed between two face plates 2 in parallel each other at the given interval to form a panel structure 4 and thick wall sections 6 are formed on corners 5 between both ends of the post plates 3, and two face plates 2 positioned on the ends of the panel structure 4. The pressure generated at the time of friction bonding is absorbed by the arrangement, and the corners 5 are not swollen so as not to generate the shortage of metal of the bonding section 13, nor generate the defects in a plastic flow zone, nor damage the lightweight properties of the bonding panel structure, and the deformation, buckling, swelling and defects of the bonding section generated at the time of friction bonding are controlled, and the friction bonding of good bonding quality and good finishing can be provided. The manufacture of a large panel, therefore, can be achieved by less man-hours and the low cost thereof can be provided.
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Inventors:
Masaki Kumagai
Nao Tanaka
Yasunaga Ito
Nao Tanaka
Yasunaga Ito
Application Number:
JP22417398A
Publication Date:
September 02, 2003
Filing Date:
August 07, 1998
Export Citation:
Assignee:
Sumitomo Light Metal Industry Co., Ltd.
International Classes:
F16B11/00; B23K20/12; B32B3/06; B32B3/12; F16B12/08; (IPC1-7): B23K20/12; B32B3/06; B32B3/12; F16B11/00; F16B12/08
Domestic Patent References:
| JP9309164A | ||||
| JP10128473A | ||||
| JP11350646A | ||||
| JP11254155A | ||||
| JP11226755A | ||||
| JP2000681A |
Attorney, Agent or Firm:
Fukuda Yasuo (1 person outside)