Title:
BONDING SURFACE STRUCTURE AND ITS BONDING STRUCTURE
Document Type and Number:
Japanese Patent JP3391290
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To render it possible to improve reliability of adhesion of a product.
SOLUTION: There are formed plural kinds of adhesive layers, which are different in their chemical composition and therefore different in chemical characteristics, physical characteristics and the like from each other, next to each other in an adhesive layer-forming surface region 2. For example, when an adhesive layer durable in a high temperature environment and also resistant to impact is required, an adhesive layer 4a durable in a high temperature environment and an adhesive layer 4b resistant to impact are formed next to each other in the adhesive layer-forming surface region 2. Thus, formation of plural adhesive layers 4a and 4b different in characteristics next to each other in the adhesive layer-forming surface region 2 gives an adhesive layer durable in a high temperature environment and also resistant to impact as a whole in the adhesive layer-forming surface region 2 thereby enabling improvement in reliability of adhesion of a product.
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Inventors:
Wataru Kakinoki
Application Number:
JP8610799A
Publication Date:
March 31, 2003
Filing Date:
March 29, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C09J7/22; G06K19/02; C09J5/00; C09J7/35; G06K19/077; (IPC1-7): G06K19/077; C09J5/00
Domestic Patent References:
| JP5281908A | ||||
| JP8192104A | ||||
| JP741734A | ||||
| JP2000212517A | ||||
| JP4264179A | ||||
| JP10214756A | ||||
| JP7323686A | ||||
| JP8282168A |
Attorney, Agent or Firm:
Kiyoshi Igarashi