Title:
BORING AUTOMATED SYSTEM FOR COMPONENT CARRIER STRUCTURE
Document Type and Number:
Japanese Patent JP2023073993
Kind Code:
A
Abstract:
To provide a boring processing which can be efficiently re-tracked by a drill hole in a component carrier.SOLUTION: An apparatus (100) comprises: a boring stage (120) that is constructed so as to boring a boring component carrier structure (101) in accordance with a boring processing; and a fixing system that is constructed so as to fix and/or perform a positioning the component carrier structure (101) in the boring stage (120). The apparatus (100) further comprises: a tracing system (102) related to a tracing data derived from at least one of the component carrier structure (101), the fixing system, and the boring processing; and a communication system (160) related to the tracing system (102). The communication system (160) is constructed so as to manage the tracing data acquired by the tracing system (102).SELECTED DRAWING: Figure 1
Inventors:
HEINZ HABENBACHER
GROSS CHRISTOPH
GROSS CHRISTOPH
Application Number:
JP2022180599A
Publication Date:
May 26, 2023
Filing Date:
November 10, 2022
Export Citation:
Assignee:
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
International Classes:
H05K3/00; B23B41/00
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office