PURPOSE: To prevent migration and to assure high and stable brazing strength by using the specifically composed brazing material for brazing of electronic parts.

CONSTITUTION: The brazing member consisting of an Au alloy contg. 10 to 35wt.% Ag, 3 to 15wt.% in total of at least one kind among In, Ge and Ga and consisting of the blanace Au alloy is used for brazing of the electronic parts, such as IC packages and external leads. The generation of the so-called electromigration that the whisker-like and dendrite-like products of the brazing material components are formed and grown by the voltage at the time of use and moisture in the use environment arising from the narrowing of in the lead spacings by the reduction in the size and the increase in the density of the electronic parts and short to adjacent leads is prevented and the high and stable brazing strength is thus obtd. by using this brazing material.