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Title:
BREAKING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP2002110589
Kind Code:
A
Abstract:

To provide a breaking apparatus and method for precise and easy breaking along programmed breaking line, with relatively simple and high cost performance processing means.

The breaking apparatus and method comprise a laser 3 for heating the programmed breaking line 7 of a material 1 to be broken, and a jig 4 for providing stiffness to the material 1 to be broken at the both sides of programmed breaking line 7.


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Inventors:
SAWADA KOICHI
ITO YOSHIKI
IWAZU SATOSHI
SAWADA NAOKI
Application Number:
JP2000302035A
Publication Date:
April 12, 2002
Filing Date:
October 02, 2000
Export Citation:
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Assignee:
SONY CORP
International Classes:
B23K26/38; B23K26/40; C03B33/033; C03B33/09; H01L21/301; (IPC1-7): H01L21/301; C03B33/09
Attorney, Agent or Firm:
Hiroshi Osaka



 
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