To provide a method for effectively preventing chip defect or crack by shortening TAT(turn-around-time) for dividing a semiconductor bar into individual semiconductor chip and containing them in a tray; reducing occupied area of production floor for apparatus, jig for conveyance, and storage site for materials in process; and combining methods for dividing the semiconductor bar into individual chips to add stable stress to the semiconductor chip.

A chip manufacturing apparatus 101 consistent with the invention comprises a laser irradiating section 106 for forming melting dent 107 on the programmed division line 8 with the semiconductor bar 2 held and sequentially moved by a roll UV adhesive tape 102, a dividing section 108 for dividing the semiconductor bar 2, a heating lamp 111 for widening spacing of the semiconductor chip 1, a UV irradiation lamp 112 for lowering the holding power of the adhesive tape 102, and a vacuum absorption collet 115 for shuffling the semiconductor chip 1 to a containing tray 114 respectively arranged along its moving path in this order.