BUILDUP MULTILAYER PRINTED WIRING BOARD AND ITS RELATED PRODUCT

Japanese Patent JP2003206404

A

To obtain a resin composition for buildup, which does not generate hydrogen bromide, etc., being a poisonous gas in combustion, has excellent heat resistance and moisture resistance and can shorten a process for manufacturing an IVH-containing buildup multilayer printed wiring board.

This resin composition for buildup comprises (A) a thermoplastic resin or thermosetting resin having ≥10,000 weight-average molecular weight, (B) an epoxy resin, (C) a crosslinked phenoxyphosphazene compound, (D) an inorganic filler, (E) a coupling agent, (F) a curing agent and (G) a curing promoter as essential components in the ratio of 50-80 wt.% of (A) the thermoplastic resin or thermosetting resin based on the total amount of the components (A) to (G) and is applied to a buildup multilayer printed wiring board obtained by filling through holes of an IVH-containing inner layer plate and simultaneously carrying out buildup.

JP2009501255	Fluid thermoplast with halogen flameproofing agent
JP3766240	MODIFIED LAMINAR SILICATE, MODIFIED LAMINAR SILICATE/RESIN COMPLEX AND THERMOPLASTIC RESIN COMPOSITION CONTAINING THE COMPLEX
JPS56133340	FLAME RETARDANT COMPOSITION

INMAKI NORIKO
OGAWA KATSURA
IWASAKI TOMOHIRO
TADA YUJI

JP2002005452A

July 22, 2003

January 15, 2002

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KYOCERA CHEM CORP
OTSUKA CHEM HOLDINGS CO LTD

C08L101/00; C08G79/02; C08G79/025; C08K3/00; C08K5/00; C08L63/00; C08L85/02; H05K3/46; (IPC1-7): C08L101/00; C08G79/02; C08K3/00; C08K5/00; C08L63/00; C08L85/02; H05K3/46

Eiji Morota

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