Title:
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP
Document Type and Number:
Japanese Patent JP3659406
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bump structure having a solid structure and to provide a method of manufacturing a bump.
SOLUTION: In the method of manufacturing the bump, the bump is manufactured in such a way that a metal ball 14 is formed at the tip of a wire which is passed through a capillary 11 for bump manufacturing. While the metal ball 14 is pressed to a pad electrode part 23 at a semiconductor element in which the bump is formed, ultrasonic waves are applied in a first direction, and a first bump 15 is formed. After the first bump is formed, the metal ball is pressed further onto the first bump. While ultrasonic waves are applied in a second direction crossing the first direction, a second bump 35 is formed.
Inventors:
Masayuki Kikushima
Application Number:
JP2001173026A
Publication Date:
June 15, 2005
Filing Date:
June 07, 2001
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP3187228A | ||||
| JP11233543A | ||||
| JP10303249A | ||||
| JP8264540A |
Attorney, Agent or Firm:
岡▲崎▼ 信太郎
Arai Zen
Arai Zen