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Patent Searching and Data


Title:
BUNDLING AND PACKAGING MATERIAL AND PACKAGING MATERIAL FOR FOOD
Document Type and Number:
Japanese Patent JPH11314307
Kind Code:
A
Abstract:

To considerably inhibit deterioration of contents and preserve the contents for long period by providing a laminate having a gas barrier layer composed of a resin composition having an inorganic layered compound, and bundling a part thereof.

A laminate having a gas barrier layer 3, which is composed of a resin composition having an inorganic layered compound, is provided, and a part thereof is bundled after the contents are packaged. The inorganic layered compound used for the gas barrier layer 3 is an inorganic compound having a layered structure wherein unit crystal layers are put on top ofeach other, e.g. a graphite, a phosphoric acid zirconium compound, a chalcogen compound, a clay mineral or the like. In a laminating method of the gas barrier layer 3, a coating liquid of the resin composition can be used. A resin containing a high hydrogen-bonding resin having a hydrogen-bonding group or an ionic group is preferable used. An anchor layer 2 is formed between the base 1 and the gas barrier layer 3.


Inventors:
KURODA TOSHIYA
SAKATANI TAIICHI
Application Number:
JP12380398A
Publication Date:
November 16, 1999
Filing Date:
May 06, 1998
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
B65D30/02; B32B9/00; B32B15/08; B32B15/085; B32B27/32; B65D65/40; B65D81/24; (IPC1-7): B32B9/00; B32B15/08; B32B27/32; B65D30/02; B65D65/40; B65D81/24
Attorney, Agent or Firm:
Kenzo Hara