Title:
BUS-BAR WIRING BOARD
Document Type and Number:
Japanese Patent JP3456185
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce the number of components and assembly man-hours, when a plurality of bus-bar wiring boards are layered to form a wiring assembly unit.
SOLUTION: First surface side bus-bars 12 of a first wiring layer 13, formed on a first surface 11a of an insulating board 11, and second surface side bus-bars 14 of a second wiring layer 15, formed on a second surface 11b of the insulating board 11, are connected electrically to each other via through-holes 20 formed in the insulating board 11. When the insulating board 11 is molded, the second wiring layer 15 is formed integrally with the insulating board 11, so as to be isolated from the outside with an insulating layer 18 provided by the insulating board 11.
Inventors:
Yukinori Kita
Application Number:
JP2000004775A
Publication Date:
October 14, 2003
Filing Date:
January 13, 2000
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS,LTD.
International Classes:
B60R16/02; H01R4/58; H02G3/16; (IPC1-7): H02G3/16; B60R16/02; H01R4/58
Domestic Patent References:
| JP8163745A | ||||
| JP11215650A | ||||
| JP929445A | ||||
| JP2000125447A | ||||
| JP2000125446A | ||||
| JP200116745A | ||||
| JP2000324657A |
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)