ＣＭＰパッドコンディショナー - Ifa Diamond Industrial Company, Limited

Title:

ＣＭＰパッドコンディショナー

Document Type and Number:

Japanese Patent JP5843120

Kind Code:

B2

Abstract:

The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

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Inventors:

Lee
Li, Juhan

Application Number:

JP2014521548A

Publication Date:

January 13, 2016

Filing Date:

July 16, 2012

Export Citation:

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Assignee:

Ifa Diamond Industrial Company, Limited

International Classes:

B24B53/12; B24B37/00; B24D3/00; H01L21/304

Domestic Patent References:

JP2010069612A
JP2010125587A
JP2004537646A
JP2003175465A

Foreign References:

WO2012122186A1

Attorney, Agent or Firm:

▲吉▼川俊雄
Kana Ichikawa

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