Title:
CMP POLISHING PAD
Document Type and Number:
Japanese Patent JP2023008827
Kind Code:
A
Abstract:
To provide a polishing pad useful in chemical mechanical polishing.SOLUTION: A polishing pad has a polishing layer. The polishing layer comprises: a polymer matrix comprising the reaction product of an isocyanate-terminated urethane prepolymer and a chlorine-free aromatic polyamine curing agent; and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 micrometers or 15 to 30 micrometers. The polishing layer is chlorine-free.SELECTED DRAWING: None
Inventors:
QIAN BAINIAN
ALDEN DONNA M
MATTHEW CIMOCH
CHIOU NAN-RONG
TSENG SHENG-HUAN
ALDEN DONNA M
MATTHEW CIMOCH
CHIOU NAN-RONG
TSENG SHENG-HUAN
Application Number:
JP2022087325A
Publication Date:
January 19, 2023
Filing Date:
May 30, 2022
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC
International Classes:
H01L21/304; B24B37/24
Attorney, Agent or Firm:
Patent Attorney Corporation Tsukuni
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