Title:
CALIBRATION WAFER AND ITS FORMATION
Document Type and Number:
Japanese Patent JPH11142299
Kind Code:
A
Abstract:
To enable more frequent use of a calibration wafer for a longer time, by carrying out a heat treatment in a temperature range where a polymer particle starts to soften and fixing the polymer particle on the calibration wafer.
A heat treatment is carried out in a temperature range where a polymer particle P starts to soften, experimentally, 80-95°C, thereby fixing the polymer particle P on a calibration wafer W. In cleaning and removing a sediment on the wafer W in the form of, e.g. ammonium salt, the polymer particle P keeps adhering to the wafer W without being removed from on the wafer W. Therefore, the wafer W can be used more frequently for a longer time, thus saving costs.
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Inventors:
GEYER STEFAN
HORN MICHAEL DR
GOETHEL RALF
KURTH KATRIN
HORN MICHAEL DR
GOETHEL RALF
KURTH KATRIN
Application Number:
JP23728798A
Publication Date:
May 28, 1999
Filing Date:
August 24, 1998
Export Citation:
Assignee:
SIEMENS AG
International Classes:
G01N1/28; G01N21/88; G01N21/93; H01L21/304; H01L21/66; G01N1/00; H01L23/544; (IPC1-7): G01N1/00; G01N1/28; H01L21/66
Attorney, Agent or Firm:
Toshio Yano (3 outside)
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