Title:
【発明の名称】高耐圧半導体装置
Document Type and Number:
Japanese Patent JP3221673
Kind Code:
B2
Inventors:
Hideyuki Nakamura
Application Number:
JP28545589A
Publication Date:
October 22, 2001
Filing Date:
November 01, 1989
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L29/73; H01L21/331; H01L29/732; (IPC1-7): H01L29/732; H01L21/331
Domestic Patent References:
| JP63155763A | ||||
| JP58192369A | ||||
| JP5913370A | ||||
| JP58192368A | ||||
| JP58164263A |