Title:
高い熱安定性を有する少なくとも１つのポリマーでカプセル化されたコンデンサ
Document Type and Number:
Japanese Patent JP7349026
Kind Code:
B2
Abstract:
Some embodiments of the present disclosure relate to a device comprising: a capacitor and at least one encapsulant. In some embodiments, the at least one encapsulant comprises at least one polymer. In some embodiments, the at least one encapsulant at least partially encapsulates the capacitor. In some embodiments, the at least one encapsulant has a stable Young's modulus. Some embodiments of the present disclosure further relate to methods of manufacturing and using the device described herein. In the examples the at least one polymer is a PVDF.
Inventors:
Luis Emanueli
Thomas Cooper
Robert Bell
Venkateswaran Santhanam
Thomas Cooper
Robert Bell
Venkateswaran Santhanam
Application Number:
JP2022533460A
Publication Date:
September 21, 2023
Filing Date:
December 04, 2019
Export Citation:
Assignee:
W.L. GORE & ASSOCIATES, INCORPORATED
International Classes:
H01G2/10; H01G4/224; H01G4/32; H01G9/08; H01G13/00
Domestic Patent References:
| JP2015073097A | ||||
| JP2269771A | ||||
| JP2014001347A | ||||
| JP2008528789A | ||||
| JP2014519208A | ||||
| JP2009097013A |
Foreign References:
| WO2019189894A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Satoshi Deno
Shujiro Aoki
Yasuo Dogaki
Shinji Mihashi
Satoshi Deno
Shujiro Aoki
Yasuo Dogaki