To provide a carrier-attached very thin copper foil wherein etching with a very narrow width in terms of a line/space of 15 μm/15 μm or below can be attained and no broken line due to pin holes is caused when a line of 15μm is etched.

In the carrier-attached very thin copper foil comprising lamination of an exfoliation layer and a very thin copper foil on a carrier foil laminated in this order, (1) the very thin copper layer is formed by using one of the electroless plating method, the vacuum deposition method, the sputtering method, and the chemical vapor deposition method. Further, (2) the very thin copper layer comprises an upper layer and a lower layer. The lower layer is formed by using one of the electroless plating method, the vacuum deposition method, the sputtering method; and the chemical vapor deposition method, and the upper layer formed on the lower layer is formed by using one method or two or more of combined methods of the electroless plating method, the vacuum deposition method, the sputtering method, and the chemical vapor deposition method.