CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE SHEET, ELECTRONIC EQUIPMENT, LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD

Title:

CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE SHEET, ELECTRONIC EQUIPMENT, LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD

Document Type and Number:

Japanese Patent JP2015200025

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide carrier-provided copper foil having good circuit formability.SOLUTION: Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carrier is peeled from the carrier-provided copper foil, the average value of the abundance ratio of nickel oxide and nickel hydroxide in Ni, (NiO+Ni(OH))/Ni, is 5-50%, determined by XPS analysis of the surface of the carrier on the side of the intermediate layer.

Inventors:

HONDA MISATO
ISHII MASASHI
MIYAMOTO NOBUAKI

Application Number:

JP2015074321A

Publication Date:

November 12, 2015

Filing Date:

March 31, 2015

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP

International Classes:

C25D1/04; B32B15/01; C23C28/00; C25D5/12; C25D7/06; H05K1/09

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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