Title:
CARRIER TAPE, PACKAGE, AND MANUFACTURING METHOD OF PACKAGE
Document Type and Number:
Japanese Patent JP2021138400
Kind Code:
A
Abstract:
To provide a carrier tape for a package which enhances the manufacturing efficiency of the package for accommodating a component, and can suppress the damage of the component, the package and a manufacturing method of the package.SOLUTION: A carrier tape for a package for accommodating a component comprises a laminate, a penetration hole and a bottom tape. The laminate has a first mount, and a second mount arranged on the first mount, and lower than the first mount in ventilation performance. The penetration hole is formed so as to penetrate the laminate, and to allow the insertion of the component therein. The bottom tape is pasted to a surface of the first mount so as to cover the penetration hole.SELECTED DRAWING: Figure 3
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Inventors:
SUGAI KAZUO
Application Number:
JP2020036566A
Publication Date:
September 16, 2021
Filing Date:
March 04, 2020
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
B65D73/02; B65B15/04
Attorney, Agent or Firm:
Junichi Omori
Chiba Ayako
Chiba Ayako