Title:
センタ及び研削盤
Document Type and Number:
Japanese Patent JP6776660
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable the same device to continuously perform center hole correction processing and grinding of a workpiece.SOLUTION: A center 42 has a taper surface 142 which slidably contacts with a center hole. The taper surface 142 includes: an abrasive grain part 142b having abrasive grains for grinding the center hole; and support parts 142a which support the center hole so as to slidably contact therewith. The support parts 142a are provided in at least three positions in a circumferential direction of the taper surface 142.SELECTED DRAWING: Figure 6
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Inventors:
Akira Watanabe
Application Number:
JP2016130203A
Publication Date:
October 28, 2020
Filing Date:
June 30, 2016
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B24B41/06; B23B23/00; B24B5/04; B24B5/14; B24D5/00
Domestic Patent References:
| JP9085505A | ||||
| JP7116901A | ||||
| JP2007301653A |
Foreign References:
| US5957017 |
Attorney, Agent or Firm:
Okada International Patent Office