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Title:
CENTRIPETAL APPARATUS AND CENTRIPETAL METHOD FOR WAFER
Document Type and Number:
Japanese Patent JP2008218903
Kind Code:
A
Abstract:

To provide a centripetal apparatus and a centripetal method for a wafer capable of obtaining the center of the wafer using two sensors always with accuracy.

A semiconductor wafer 2 ejected from a cassette 1 is conveyed by a conveyer arm 5 to a rotation table 6 along a wafer conveyer path. An edge of the semiconductor wafer 2 is detected by photoelectronic sensors 9 and 10. The center of the semiconductor wafer 2 is obtained based on this edge information. The conveyer arm 5 is controlled so as to put the semiconductor wafer 2 at a reference position of the rotation table 6 in accordance with the obtained information. Whether or not the center of the semiconductor wafer 2 can be obtained from the edge information detected by the photoelectronic sensors 9 and 10 is determined, and if not, the semiconductor wafer 2 is rotated by a predetermined angle, and the semiconductor wafer 2 is set back to the cassette 1 side by the conveyer arm 5, and then conveyed to the rotation table 6 again.


Inventors:
NIREI TATSUO
KATO TOMOO
NAKASENDO HISASHI
TSUCHISAKA SHINICHI
Application Number:
JP2007057497A
Publication Date:
September 18, 2008
Filing Date:
March 07, 2007
Export Citation:
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Assignee:
OLYMPUS CORP
International Classes:
H01L21/68; H01L21/677
Domestic Patent References:
JP2003254738A2003-09-10
JP2005297072A2005-10-27
JP2000164680A2000-06-16
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto