Title:
CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3152344
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To absorb strain, caused by the thermal expansion coefficient difference between a ceramic board and each of first and second aluminum boards, even if a heat cycle is applied, by providing the first and second aluminum boards laminated respectively on both sides of the ceramic board made out of Si3N4 interposing Al-Si brazing filler metals in between.
SOLUTION: To laminate first and second aluminum boards 11, 12 on both sides of a ceramic board 13 by adhesion, an Al-Si brazing filler metal, the ceramic board 13, and Al-Si brazing filler metal, and a second aluminum board 12 are piled up, and a load 0.5-5kgf/cm2 is applied to these in that state, and they are heated in a vacuum to 600-630°C. Even if a heat cycle is applied to this circuit board, it is possible to absorb strain generated by the thermal expansion coefficient difference between the ceramic board 13 and each of the first and second aluminum boards 11, 12, by the elastic deformation of the aluminum boards, having smaller deformation resistances compared with the metallic member made of Cu, etc., heretofore in use.
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Inventors:
Toshiyuki Nagase
Shiro Kuromitsu
Yoshio Kanda
Masafumi Hatsushika
Shiro Kuromitsu
Yoshio Kanda
Masafumi Hatsushika
Application Number:
JP22147896A
Publication Date:
April 03, 2001
Filing Date:
August 22, 1996
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
H05K1/09; B32B18/00; C04B37/02; H01L23/15; H05K1/03; H05K3/38; (IPC1-7): H05K1/09; B32B18/00; C04B37/02; H01L23/15; H05K1/03; H05K3/38
Domestic Patent References:
| JP5191018A | ||||
| JP7227680A | ||||
| JP8319187A |
Attorney, Agent or Firm:
Masayoshi Suda