Title:
セラミック複合多層基板及びその製造方法並びに電子部品
Document Type and Number:
Japanese Patent JP5029699
Kind Code:
B2
Abstract:
A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer and a second ceramic layer that is disposed so as to contact the first ceramic layer and suppresses firing shrinkage in the plane direction of the first ceramic layer. The laminate includes a resin/ceramic composite layer in which porous ceramic is impregnated with a resin formed on at least one principal surface of the laminate.
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Inventors:
Masato Nomiya
Application Number:
JP2009543717A
Publication Date:
September 19, 2012
Filing Date:
October 17, 2008
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/46; H01L23/12; H01L23/13
Domestic Patent References:
| JP2006278453A | 2006-10-12 | |||
| JP2000315864A | 2000-11-14 | |||
| JP2006100443A | 2006-04-13 | |||
| JP2002344121A | 2002-11-29 |
Attorney, Agent or Firm:
Hajime Ohara