Title:
CERAMIC LID FOR PACKAGE
Document Type and Number:
Japanese Patent JP3183090
Kind Code:
B2
Abstract:
PURPOSE: To give an excellent conductivity and heat conductivity to a ceramic base material with a thermal expansion coefficient base material close to that of alumina by a method wherein a metal, Cu, is contained in the ceramic base material, which consists mainly of a silicon carbide, at a specified rate.
CONSTITUTION: A ceramic base material, which contains a silicon carbide as its main component, is used for forming a ceramic lid for package and a metal, Cu, is contained in the ceramic base material at a rate of 20 to 40volume%. Or a ceramic base material, which consists mainly of an aluminum nitride, is used for forming the ceramic lid and a metal, Al, or a metal, Cu, is contained in the ceramic base material at a rate of 20 to 40volume%. Thereby, both of the conductivity and the heat conductivity of the ceramic base materials are enhanced. When the thermal expansion coefficient of the ceramic base materials is brought close to that of alumina, a high-airtightness ceramic lid can be formed. In the case where the metal Cu or the metal Al is less than 20volume%, a metallic circuit is not stably formed. As a result, the resistivity of the ceramic base materials can not be made low. On the other hand, when the metal Cu or the metal Al exceeds 40volume%, the thermal expansion coefficient is too large. As a result, the ceramic base materials become unsuitable for practical use due to the generation of a strain or the like at the time of a temperature rise.
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Inventors:
Masaya Hashimoto
Application Number:
JP8104295A
Publication Date:
July 03, 2001
Filing Date:
April 06, 1995
Export Citation:
Assignee:
SUMITOMO METAL INDUSTRIES,LTD.
International Classes:
H01L23/04; H01L23/02; H01L23/06; (IPC1-7): H01L23/02
Domestic Patent References:
| JP60143653A | ||||
| JP316986A | ||||
| JP59199587A | ||||
| JP59228742A |
Attorney, Agent or Firm:
Ryuji Inouchi