Title:
CERAMIC PACKAGE FOR ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP3445761
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic package for an electronic device in which electrical defects due to milted excess solder are prevented in the case of solder sealing with a metal cap.
SOLUTION: A ceramic package main body 1 is constituted of a ceramic substrate 11 of a first layer and hollow ceramic substrates 12, 13 of second and third layers in which an electronic device 3 is accommodated. A metal cap 2 is made by rolling a metal plate of kovar or the like whose coefficient of thermal expansion is approximate to that of a solder plate and ceramic. Metallized patterns 15 for making melted excess solder escape are continuously connected with a solder sealing metallized pattern 14 which is formed on an upper aperture part of the ceramic package main body 1, and formed on four corners of the side surface of the ceramic package main body 1, in a range not reaching the ceramic substrate 11 of a first layer.
Inventors:
Yoshihiro Takahashi
Application Number:
JP27600999A
Publication Date:
September 08, 2003
Filing Date:
September 29, 1999
Export Citation:
Assignee:
NRS Technology Co., Ltd.
International Classes:
H01L23/02; (IPC1-7): H01L23/02
Domestic Patent References:
| JP2174143A | ||||
| JP180938U | ||||
| JP2125345U |