Title:
酸化型の金属類の化学機械研磨
Document Type and Number:
Japanese Patent JP4773370
Kind Code:
B2
Abstract:
The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, (ii) a reducing agent, and (iii) a liquid carrier, and (c) abrading at least a portion of the metal in an oxidized form to polish the substrate. The reducing agent can be selected from the group consisting of 3-hydroxy-4-pyrones, alpha-hydroxy-gamma-butyrolactones, ascorbic acid, borane, borohydrides, dialkylamine boranes, formaldehyde, formic acid, hydrogen, hydroquinones, hydroxylamine, hypophosphorous acid, phosphorous acid, a metal or metal ions in an oxidation state having a standard redox potential that is less than the standard redox potential of the metal in an oxidized form, trihydroxybenzenes, solvated electrons, sulfurous acid, salts thereof, and mixtures thereof.
More Like This:
Inventors:
Deleghe Tesoro, Francesco
Bursick, blaster
Buyer, Benjamin Pee.
Bursick, blaster
Buyer, Benjamin Pee.
Application Number:
JP2006549348A
Publication Date:
September 14, 2011
Filing Date:
January 05, 2005
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14; H01L21/321; H01L21/768
Domestic Patent References:
| JP2002033298A | 2002-01-31 | |||
| JP2001089747A | 2001-04-03 | |||
| JP2001185515A | 2001-07-06 | |||
| JP2000160139A | 2000-06-13 | |||
| JPH09137155A | 1997-05-27 | |||
| JP2000124175A | 2000-04-28 |
Foreign References:
| WO2003083920A1 | 2003-10-09 | |||
| US20020042208A1 | 2002-04-11 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi
Takashi Ishida
Tetsuji Koga
Masatoshi Takahashi