CHEMICAL MECHANICAL POLISHING PAD AND COMPOSITION THEREFOR

Title:

CHEMICAL MECHANICAL POLISHING PAD AND COMPOSITION THEREFOR

Document Type and Number:

Japanese Patent JP2007318074

Kind Code:

A

Abstract:

To provide a composition for a chemical mechanical polishing pad to be suitably used for manufacturing a polishing pad whose polishing speed is large, which is excellent in the surface status of a face to be ground, and whose useful life is long, and to provide a chemical mechanical polishing pad manufactured from the composition.

This composition for a chemical mechanical polishing pad contains polymer 100 pts.mass (A) containing 1,2-polybutadiene; water-soluble substance (B) of 5 to 80 volume% to the total volume of the polymer (A), and water-soluble substance (B); organic peroxide 0.01 to 10 pts.mass or vulcanizing agent 0.1 to 20 pts.mass (C); and silica 3 to 100 pts.mass (D). The chemical mechanical polishing pad is manufactured from the composition.

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Inventors:

SUGIURA KAZUO
OKAMOTO TAKAHIRO

Application Number:

JP2007009534A

Publication Date:

December 06, 2007

Filing Date:

January 18, 2007

Export Citation:

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Assignee:

JSR CORP

International Classes:

H01L21/304; B24B37/20; B82Y10/00; B82Y30/00; B82Y40/00; C08J5/14; C08K3/36; C08K5/14; C08K5/54; C08L9/00

Attorney, Agent or Firm:

Masataka Oshima
Hideo Katsumata
Taizo Shiraishi

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