化学増幅型ポジ型レジスト組成物

Title:

化学増幅型ポジ型レジスト組成物

Document Type and Number:

Japanese Patent JP4524940

Kind Code:

B2

Abstract:

A chemical amplifying type positive resist composition, excellent in balance of performance of resolution and sensitivity, having high dry etching resistance and comprising;a resin having a polymerization unit derived from a monomer represented by the following formula (I):wherein R1 and R2 independently represent hydrogen or an alkyl group having 1 to 4 carbons, and R3 represents hydrogen or a methyl group,the resin being insoluble in alkali itself but becoming alkali-soluble due to the action of an acid; and an acid generating agent is provided.

More Like This:

JP4687878	Polymer compounds, resist materials and pattern forming methods
JP5440515	Resist material and pattern formation method
JP6931663	Sensitive light-sensitive or radiation-sensitive resin composition, sensitive light-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing an electronic device, and photoacid generator.

Inventors:

Yoshiko Miya
Yasunori Uetani
Hiroaki Fujishima

Application Number:

JP2001073810A

Publication Date:

August 18, 2010

Filing Date:

March 15, 2001

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Sumitomo Chemical Co., Ltd.

International Classes:

G03F7/039; C08K5/00; C08L37/00; G03F7/004; H01L21/027

Domestic Patent References:

JP2000137327A
JP10274852A
JP9073173A
JP2001051418A
JP11222460A
JP62079441A

Attorney, Agent or Firm:

Toru Nakayama

Previous Patent: 空気通路開閉装置および車両用空調装置

Next Patent: サンルーフ装置