Title:
CHEMICALLY AMPLIFYING PHOTORESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2003345025
Kind Code:
A
Abstract:
To provide a chemically amplifying photoresist composition.
The chemically amplifying photoresist composition contains a polymer having a repeated structure of a unit expressed by formula (II). In formula (II), R1 represents H or 1-4C alkyl group, R2 represents a hydroxyl group, a 1-8C alkoxyl group or a 1-8C thioalkyl group, G represents (CH2)n, O or S, wherein n is an integer 0 to 4, Rc represents a lactone group and m is an integer 1 to 3. The chemically amplifying photoresist composition is used for general lithographic processes, in particular, for lithographic processes with a light source at 193 nm wavelength to have extremely preferable resolution, profile and photosensitivity.
Inventors:
CHEN CHI-SHENG
LI YEN-CHENG
CHENG MENG-HSUM
LI YEN-CHENG
CHENG MENG-HSUM
Application Number:
JP2003134879A
Publication Date:
December 03, 2003
Filing Date:
May 13, 2003
Export Citation:
Assignee:
EVERLIGHT USA INC
International Classes:
C08F20/10; G03F7/004; G03F7/039; H01L21/027; (IPC1-7): G03F7/039; C08F20/10; H01L21/027
Attorney, Agent or Firm:
Matsumoto Takemoto (4 outside)