To provide a positive photosensitive resin composition having high exposure sensitivity even in a thick film, showing high resolution and a preferable pattern profile and having excellent heat resistance.

The positive photosensitive composition contains: (A) a polyimide precursor or a polybenzoxazole precursor; (B) a compound which generates an acid by irradiation of actinic rays; (C) a compound having an acid decomposable group which increases solubility with an alkali aqueous solution by acid catalytic reaction; (D) a compound having two or more alcoholic hydroxyl groups; and (E) a solvent.