To provide a chip component capable of improving connectivity between conductor films formed on both the prism sections and conductor films formed on a central prism section and preventing quality from lowering, even in the case where the conductor film for circuit is formed on the surface of the ceramic element provided with truncated pyramid section between the both end pyramid and central pyramid.
Since a round R3 section is larger than a roundness R1 of the ridge line of a first pyramid section 2a and a roundness R2 of the ridge line of the second pyramid section 2b, the film thickness of the roundness R3 section is closely made equal to the thickness of the planar section and far thicker than that of the roundness R1 and roundness R2. If the thickness of the conductor film 3 of the ridgeline of each 4-truncated pyramids 2c, the connectivity between the conductor films 3 on the first pyramid section 2a and on the second pyramid section 2b is lowered, and cracks run on the conductor film 3 on the same section. However, the thick conductor film 3 on the ridge line each 4-truncated pyramid 2c improves the connectivity of the conductor film 3 on the first pyramid section 2a and on the second pyramid section 2b, prevents cracks from being generated on the conductor film 3 of the same section, and improves the quality of the component.
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HARADA SHINICHI
AZUMA TOMIO
KAKIUCHI IKUO
TERAOKA MANABU
CHUKI SEIKI KK
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