Title:
CHIP-LIKE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2002033242
Kind Code:
A
Abstract:
To provide a chip-like electronic component, having a lead frame corresponding to high-density mounting.
For the chip-like electronic component, with which a lead frame 2 is led out of the side face of an outer resin 1 and bent along with the outer surface and a substrate grounding surface is made into electrode, an insulating layer 3, having drawing property is provided on the outer surface of the lead frame 2 in the outer side face part at least.
Inventors:
MURAKAMI JUNICHI
YUUHI NOBUO
YUUHI NOBUO
Application Number:
JP2000214655A
Publication Date:
January 31, 2002
Filing Date:
July 14, 2000
Export Citation:
Assignee:
NICHICON CORP
International Classes:
H01L23/29; H01G9/004; H01G9/08; H01G9/15; H01L23/31; H01L23/50; (IPC1-7): H01G9/004; H01G9/08; H01G9/15; H01L23/29; H01L23/31; H01L23/50