Title:
HEAT TREATING APPARATUS, ITS DESIGNING METHOD AND COMPUTER READABLE RECORDING MEDIUM
Document Type and Number:
Japanese Patent JP2002110585
Kind Code:
A
Abstract:
To provide a heat treating apparatus capable of heat treating a wafer at a high accuracy, its designing method and a computer readable recording medium.
The treating apparatus comprises a halogen lamp 16 for irradiating the surface of a wafer 30 with a light to heat it, a guard ring 21 for carrying the wafer 30 and a radiation thermometer 19 for detecting lights radiated from the backside of the wafer 30 to measure the temperature of the wafer 30 heated by the lamp 16. The guard ring 21 is designed so that the calculated incidence ratio of a light incident on a quartz rod 29 through a gap between the wafer 30 and the guard ring 21 is below a specified value.
Inventors:
SHIGEOKA TAKASHI
Application Number:
JP2000304098A
Publication Date:
April 12, 2002
Filing Date:
October 03, 2000
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/205; C23C16/48; C30B25/10; C30B25/12; C30B25/16; H01L21/00; H01L21/26; F27D21/00; (IPC1-7): H01L21/26; H01L21/205
Domestic Patent References:
| JP2000058470A | 2000-02-25 | |||
| JPH1083969A | 1998-03-31 | |||
| JP2002542620A | 2002-12-10 | |||
| JPH0992625A | 1997-04-04 |
Foreign References:
| WO1999050606A1 | 1999-10-07 |
Attorney, Agent or Firm:
Tadahiko Ito
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