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Title:
CHIP MOLDING AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2007044966
Kind Code:
A
Abstract:

To increase the specific gravity and flexural strength of a chip molding by strongly bonding chips together by the component of the chip itself and by heating/pressurizing, to reduce production costs, to be used in various applications, to prevent adverse influence on environment because of biodegradability when scrapped.

In the chip molding 1, the shape of a sea bream is expressed in the surface, the eyeballs 2 are protruded like a real sea bream, fine stripes are formed in the dorsal fin 3, the shapes of scales 4 are also reproduced finely, the shapes of stripes including thick and thin stripes in the tail fin 5 of a mold are transferred truly, the specific gravity is as large as about 1.27, its three-point flexural strength is as high as 14.8 MPa, and each cross section is molded in an approximately equal thickness (about 10 mm). In this way, the whole chip molding 1 is pressurized uniformly. Each part of the surface is adhered to the mold on the surface side so that even a fine pattern is transferred truly. The inside is pressurized uniformly to be a precise structure to obtain the above-mentioned large specific gravity and high flexural strength.


Inventors:
NISHIDE HIROYUKI
Application Number:
JP2005230963A
Publication Date:
February 22, 2007
Filing Date:
August 09, 2005
Export Citation:
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Assignee:
NEIVE KK
International Classes:
B27N3/02; B27N3/06; B27N3/08; B27N5/00
Domestic Patent References:
JP2004122729A2004-04-22
JP2003276012A2003-09-30
JP2004338369A2004-12-02
JP2002154105A2002-05-28
JPH1058413A1998-03-03
JPH10166323A1998-06-23
Attorney, Agent or Firm:
Takenao Higuchi