Title:
CHIP-MOUNTING CASE PROVIDED WITH CONDUCTIVE PASSAGE
Document Type and Number:
Japanese Patent JPH0521540
Kind Code:
A
Abstract:
PURPOSE: To provide a chip-mounting case wherein a wire bonding operation is simplified in an IC, an LSI or a VLSI circuit and a conductive passage is provided.
CONSTITUTION: A chip-mounting case 10 for an IC, an LSI or a VLSI circuit is constituted of the following: a synthetic-resin main body 1 forming a three- dimensional structure; and a synthetic-resin film 3 in which conductive passages 5 which are molded integrally at least on one face of it have been formed.
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Inventors:
SHIBUYA TADAMORI
Application Number:
JP7225591A
Publication Date:
January 29, 1993
Filing Date:
March 11, 1991
Export Citation:
Assignee:
TOYAMA PARTS KK
International Classes:
H01L21/60; H01L23/12; H01L23/14; (IPC1-7): H01L21/60; H01L23/12; H01L23/14
Attorney, Agent or Firm:
Tomoda Miyata (1 person outside)
Next Patent: COMBUSTION APPARATUS