To transfer a copper core solder bump of high reliability to a semiconductor chip at high yield by forming a conductor terminal of at least two layers on an epoxy resin, in a specific range of weight average molecular weight as well as a base resin which contains amino silane as an essential component.
A basic transfer bump sheet comprises a conductor terminal which comprises a metal layer and solder layer, starting from a base resin. As a base resin of a transfer bump sheet, a resin composition is used which comprises, as essential components thermoplastic silicon modified polyamide resin 100 pts.wt. which has in its main chain, a structure represented by expression (R1 and R2 are monovalent aliphatic or aromatic hydrocarbon radical, with carbon number 6 or less, while n is an integer 6-16 in the range of 6 to less than 16, epoxy resin 1-100 pts.wt. with weight average molecular weight in the range of 2,000 to less than 200,000 which is obtained by reacting oligoethyleneglycol diglycidylether with bisphenol A, and aminosilane 0.15-5.10 pts.wt.
TAKAHASHI TOYOMASA
AOKI HITOSHI
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