Title:
CHIP TYPE ELECTRIC COMPONENT AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH01259517
Kind Code:
A
Abstract:
PURPOSE: To reduce the space by an arrangement which a connecting element secured to the upper surface of a basic body is bent to the lower surface side of an insulating cover while a connecting element secured to the lower surface of the basic body is bent upward and then it is bent furthermore before being bent again at the lower surface of the insulating cover. CONSTITUTION: A basic body 1 and a part of connecting elements 5, 6 are surrounded by an insulating cover 7 and a part of the connecting elements 5, 6 projecting therefrom forms contacting parts 8, 9. In order to guide the connecting elements 5, 6 to brazing parts 10, 11 of same size on the outside of the insulating cover 7, the connecting elements 5, 6 to brazing parts 10, 11 being guided in the insulating cover 7 are bent twice into a special shape before being brazed onto terminal films 2, 3. More specifically, the contacting parts 10, 11 are preventing from having different size by folding the connecting element 6 secured to the underside of the basic body 1 thus realizing space saving.
Inventors:
GIYUNTAA OTSUTO
Application Number:
JP3090089A
Publication Date:
October 17, 1989
Filing Date:
February 08, 1989
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H01C1/14; H01C7/02; H01C7/04; H01C7/10; H01C17/00; H01C17/28; H01F27/29; H01G2/06; H01G4/252; H01G13/00; H05K7/02; (IPC1-7): H01C1/14; H01C7/02; H01C7/04; H01C7/10; H01C17/28; H01F15/10; H01G1/14; H01G13/00; H05K7/02
Attorney, Agent or Firm:
Tomimura Kiyoshi
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