Title:
はつり装置及びこれを用いたはつり工法
Document Type and Number:
Japanese Patent JP7357550
Kind Code:
B2
Abstract:
To provide a chipping device that can be easily downsized.SOLUTION: A chipping device 10 is equipped with a frame portion 11 and a joint portion 12. The frame portion 11 is provided with a work handle portion 14 that can be contacted by a worker. The joint portion 12 is provided with an injection portion 24 capable of injecting high-pressure water for chipping while rocking, a motor for rocking the injection portion 24, and a crank mechanism portion that transmits the driving force of the motor to the injection portion 24. The frame portion 11 and the joint portion 12 are separably united through a bolt 19.SELECTED DRAWING: Figure 1
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Inventors:
▲浜▼ 高志
Toshiya Ichihara
Toshiya Ichihara
Application Number:
JP2020001181A
Publication Date:
October 06, 2023
Filing Date:
January 08, 2020
Export Citation:
Assignee:
Nisshin Kiko Co., Ltd.
International Classes:
B26F3/00; E04G23/08
Domestic Patent References:
| JP2003094394A | ||||
| JP11021811A | ||||
| JP2005105753A | ||||
| JP6810405B2 | ||||
| JP5943323B2 | ||||
| JP3012035B2 | ||||
| JP2008297884A |
Foreign References:
| US5992404 |
Attorney, Agent or Firm:
Ryo Matsushita
Koji Mizuno
Keita Noguchi
Koji Mizuno
Keita Noguchi