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Title:
CHUCK TABLE MECHANISM AND TRANSPORT METHOD
Document Type and Number:
Japanese Patent JP2017195218
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To allow a tabular object such as a semiconductor wafer, to which a protective tape is stuck, to be transported well.SOLUTION: A protective tape (T) is stuck to a wafer (W), and a chuck table mechanism (100) includes a chuck table (42) for suction holding the wafer on a holding surface (43) via the protective tape. When releasing suction holding of the wafer suction held to the chuck table, control means (111) controls opening and closing of a release on-off valve (109), and releases suction force acting on the holding surface. When a detection signal from pressure detection means (107) rises to a predetermined value, suction by a suction source (102) is canceled by closing a first electromagnetic on-off valve (105), and blow fluid is supplied from a blow fluid supply source (104) by opening a second electromagnetic on-off valve (106). With such an arrangement, suction force of the chuck table can be reduced gradually.SELECTED DRAWING: Figure 3

Inventors:
KOSHIMIZU HIDEKI
Application Number:
JP2016082775A
Publication Date:
October 26, 2017
Filing Date:
April 18, 2016
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B23Q3/08; B23Q7/04; B24B7/04; B24B37/34; B24B41/06; B25J15/06; H01L21/304
Domestic Patent References:
JP2009076720A2009-04-09
JPS57188347U1982-11-30
JP2003062730A2003-03-05
JP2003017442A2003-01-17
JP2013198953A2013-10-03
JP2013184269A2013-09-19
JP2009125900A2009-06-11
JPS6484732A1989-03-30
JPH0453152A1992-02-20
JP2000252187A2000-09-14
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki