Title:
CIRCUIT BOARD, CIRCUIT BOARD MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2006140351
Kind Code:
A
Abstract:
To access a plurality of laminated semiconductor devices on each predetermined group without complicating the circuit pattern of an electric wiring board.
Almost the same circuit patterns 51 and 52 are printed to sides A and B of an electric wiring board 41, respectively. Semiconductor devices 21 and 22 are connected to these circuit patterns 51 and 52, respectively. The electric wiring board 41 to which the semiconductor devices 21 and 22 are connected is called a unit 31. A circuit board 1 is created by reflowing and laminating four units 31-34 to a main circuit board 12. When laminating the units 31-34, they are rotated at angles of 180° by a top view.
Inventors:
KATO MASUO
SUZUKI HIDETADA
OZAKI HIROTAKA
SUZUKI HIDETADA
OZAKI HIROTAKA
Application Number:
JP2004329447A
Publication Date:
June 01, 2006
Filing Date:
November 12, 2004
Export Citation:
Assignee:
SONY CORP
International Classes:
H01L25/16
Domestic Patent References:
| JP2001358285A | 2001-12-26 | |||
| JPH118347A | 1999-01-12 | |||
| JP2001053219A | 2001-02-23 | |||
| JPH08181275A | 1996-07-12 | |||
| JPH03291960A | 1991-12-24 |
Attorney, Agent or Firm:
Akira Koike
Eiichi Tamura
Seiji Iga
Eiichi Tamura
Seiji Iga
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