To achieve a more exact teaching method without requiring the work for teaching in a processing chamber.

At the time of teaching, a CCD camera 22 is attached to the lower end of the hollow portion of an rotation axis 13 of interception board 12. Furthermore, X and Y coordinates of a center of spin base 6 (center of a chuck holding position) are acquired on the basis of the plane picture of the spin base 6 photoed by the CCD camera 22. Then, a dummy wafer DW is arranged at a position presumed by the design as a chuck holding position center by using the hand 17 of a substrate conveyance robot 2. Moreover, the X and Y coordinates of the center of the dummy wafer DW are acquired on the basis of the plane picture of dummy wafer DW photoed by the CCD camera 22, so that the horizontal amount of the displacement between both centers may be acquired as instruction information on the basis of the previously acquired X and Y coordinates of the center of the chuck holding position.